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高灵敏度PVDF压电薄膜振动传感器LDTM-028K采用28μ

品牌:美国 MEAS
类别:压电薄膜振动传感器
尺寸:25mm*13.5mm
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性能特点
规格参数
应用领域

  LDTM-028K是一款具有良好柔韧性的传感器,采用28μm的压电薄膜,其上丝印银浆电极,薄膜被层压在0.125mm聚酯基片上,电极由两个压接端子引出。当压电薄膜在垂直方向受到外力作用偏离中轴线时,会在薄膜上产生很高的应变因而会有高电压输出。当直接作用于产品而使其变形时,LDTM就可以作为一个柔性开关,所产生的输出足以直接触发MOSFET和CMOS电路;如果元件由引出端支撑并自由振动,该元件就像加速度计或者振动传感器。增加质量块或者改变元件的自由长度都会影响传感器的谐振频率和灵敏度,将质量块偏离轴线可以得到多轴响应。

      产品 尺寸小,长宽:25mm*13.5mm。LDTM-028K采用悬臂梁结构,一端由端子引出信号,一端固定质量块,是一款能在低频下产生高灵敏度的振动传感器。

 

 

产品特性  

• 焊接端子连接 

• 有质量块/无质量块  

• 抗冲击性能良好  

• 工作温度:0~85°C 

• 存储温度:-40~85°C 

• 高温的LDT可以承受125°C 

The LDTM-028K  is a flexible component
comprising a 28 µm thick piezoelectric PVDF
polymer film with screen-printed Ag-ink
electrodes, laminated to a 0.125 mm polyester
substrate, and fitted with two crimped contacts.
As the piezo film is displaced from the
mechanical neutral axis, bending creates very
high strain within the piezopolymer and therefore
high voltages are generated. When the assembly  dimensions
is deflected by direct contact, the device acts as
a flexible "switch", and the generated output is
sufficient to trigger MOSFET or CMOS stages
directly. If the assembly is supported by its
contacts and left to vibrate "in free space" (with
the inertia of the clamped/free beam creating
bending stress), the device will behave as an
accelerometer or vibration sensor. Adding mass,
or altering the free length of the element by
clamping, can change the resonant frequency
and sensitivity of the sensor to suit specific
applications. Multi-axis response can be
achieved by positioning the mass off center. The
LDTM-028K is a vibration sensor where the
sensing element comprises a cantilever beam
loaded by an additional mass to offer high
sensitivity at low frequencies.

FEATURES
Solder Tab Connection
Both No Mass & With Mass Version
Withstands High Impact
Operating Temperature: 0ºC to 85ºC
Storage Temperature: -40ºC to 85 ºC
Higher Temperature Version up to 125 ºC
available on a Custom Basis

感应范围:0Hz ~ 180Hz
灵敏度:50mV/g
输出类型:模拟
工作温度:0°C ~ 85°C
特性:层压至 28μm 压电薄膜元件上的 0.005" (125μm) 聚酯层
封装/外壳:悬臂压电薄膜(晶片)
安装类型:通孔
端接:PC 引脚

                                

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